Heat and fluid flow in high-power LED packaging and applications

Luo, Xiaobing1; Hu, Run1; Liu, Sheng2; Wang, Kai3

2016-09

10.1016/j.pecs.2016.05.003

PROGRESS IN ENERGY AND COMBUSTION SCIENCE   影响因子和分区

0360-1285

1873-216X

Light-emitting diodes (LEDs) are widely used in our daily lives. Both light and heat are generated from LED chips and then transmitted or conducted through multiple packaging materials and interfaces. Part of the transmitted light converts into heat along the light propagation; in return, the accumulation of heat leads to the degradation of light output. The accumulated heat negatively influences the reliability and longevity of LEDs, and thus thermal management is critical for LED packaging and applications. On the other hand, in LED packaging processes, many fluid flow problems exist, such as phosphor coating, silicone injection, chip bonding, solder reflow, etc. Among them, phosphor coating is the most important process which is essential for LED performance. Phosphor gel is a kind of non-Newton fluid and its coating process is a typical fluid-flow problem. Overall, since LED packaging and applications present many heat and fluid flow problems, obtaining a full understanding of these problems enables advancements in the development of LED processes and designs. In this review, the emphasis is placed on heat generation in chips, heat flow in packages and application products, fluid flow in phosphor coating process, etc. This is a domain in which significant progress has been achieved in the last decade, and reporting on these advances will facilitate state-of-the-art LED packaging and application technologies. (C) 2016 Elsevier Ltd. All rights reserved.

Light-emitting diode (LED) Phosphor coating Heat generation Thermal management

SCI ; EI

英语

ESI高被引

其他

973 Project of the Ministry of Science and Technology of China[2011CB013105]

Thermodynamics ; Energy & Fuels ; Engineering

Thermodynamics ; Energy & Fuels ; Engineering, Chemical ; Engineering, Mechanical

WOS:000381531900001

PERGAMON-ELSEVIER SCIENCE LTD

20162402496949

Chip scale packages ; Coatings ; Heat generation ; Interfaces (materials) ; Light emission ; Light emitting diodes ; Packaging materials ; Phosphors ; Silicones ; Soldering ; Temperature control ; Thermal management (electronics)

Soldering:538.1.1 ; Fluid Flow, General:631.1 ; Packaging Materials:694.2 ; Semiconductor Devices and Integrated Circuits:714.2 ; Specific Variables Control:731.3 ; Light/Optics:741.1 ; Coating Materials:813.2 ; Organic Polymers:815.1.1 ; Materials Science:951

ENGINEERING

Web of Science

1.Huazhong Univ Sci & Technol, Sch Energy & Power Engn, State Key Lab Coal Combust, Wuhan 430074, Peoples R China
2.Wuhan Univ, Sch Power & Mech Engn, Wuhan 430073, Peoples R China
3.South Univ Sci & Technol China, Dept Elect & Elect Engn, Shenzhen 518055, Peoples R China

Luo, Xiaobing,Hu, Run,Liu, Sheng,et al. Heat and fluid flow in high-power LED packaging and applications[J]. PROGRESS IN ENERGY AND COMBUSTION SCIENCE,2016,56:1-32.

Luo, Xiaobing,Hu, Run,Liu, Sheng,&Wang, Kai.(2016).Heat and fluid flow in high-power LED packaging and applications.PROGRESS IN ENERGY AND COMBUSTION SCIENCE,56,1-32.

Luo, Xiaobing,et al."Heat and fluid flow in high-power LED packaging and applications".PROGRESS IN ENERGY AND COMBUSTION SCIENCE 56(2016):1-32.