High-Fidelity Conformal Printing of 3D Liquid Alloy Circuits for Soft Electronics

Zhang, Shuo1; Wang, Bei1,2; Jiang, Jiajun1; Wu, Kang1; Guo, Chuan Fei3; Wu, Zhigang1,2

2019-02-20

10.1021/acsami.8b20595

ACS Applied Materials & Interfaces   影响因子和分区

1944-8244

1944-8252

Owing to the great deformability from fluid, liquid alloy-based soft electronics has inherent advantages over rigid-based ones for applications such as stretchable intelligence or soft robotics, where high fidelity of three-dimensional (3D) conformability or dynamic morphology is required. However, current fabrications heavily rely on planar techniques, which severely limit their great potential in such attracting applications. By tuning the wettability of liquid alloy on a soft substrate through a selective surface morphology modification, we present a flexography printing technique of liquid alloy circuits on both planar (from diverse materials) and 3D complex surfaces and investigate the tuning mechanism and the relation between liquid alloy wettability and surface morphology modification. In a demonstration, high-fidelity printing of liquid alloy circuits can be deployed not only on the outline but also on small pits of strawberry surface, and the circuits work well in a dynamic deformation. Furthermore, being compatible with current industry process, our technique can be highly potential for future mass manufacturing of liquid alloy-based soft electronics.

wettability tune flexography printing liquid alloy conformal printing surface morphology control

SCI ; EI

英语

其他

Guangdong Innovative and Entrepreneurial Research Team Program[2016ZT06G587]

Science & Technology - Other Topics ; Materials Science

Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary

WOS:000459642200049

AMER CHEMICAL SOC

20190806518806

Deformation ; Electronics industry ; Liquids ; Morphology ; Surface morphology ; Timing circuits ; Wetting

Pulse Circuits:713.4 ; Materials Science:951

Web of Science

1.Huazhong Univ Sci & Technol, State Key Lab Digital Mfg Equipment & Technol, Wuhan 430074, Peoples R China
2.Uppsala Univ, Dept Engn Sci, Box 534, S-75121 Uppsala, Sweden
3.Southern Univ Sci & Technol, Dept Mat Sci & Engn, Shenzhen 518055, Guangdong, Peoples R China

Zhang, Shuo,Wang, Bei,Jiang, Jiajun,et al. High-Fidelity Conformal Printing of 3D Liquid Alloy Circuits for Soft Electronics[J]. ACS Applied Materials & Interfaces,2019,11(7):7148-7156.

Zhang, Shuo,Wang, Bei,Jiang, Jiajun,Wu, Kang,Guo, Chuan Fei,&Wu, Zhigang.(2019).High-Fidelity Conformal Printing of 3D Liquid Alloy Circuits for Soft Electronics.ACS Applied Materials & Interfaces,11(7),7148-7156.

Zhang, Shuo,et al."High-Fidelity Conformal Printing of 3D Liquid Alloy Circuits for Soft Electronics".ACS Applied Materials & Interfaces 11.7(2019):7148-7156.