Kinematic modeling of surface topography ground by an electroplated diamond wheel

Li，Changsheng1; Zhang，Liangchi2,3; Ding，Jianjun1; Wu，Chuhan4; Sun，Lin1; Lin，Qijing1; Jiang，Zhuangde1

2021

10.1007/s00170-021-06944-4

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY   影响因子和分区

0268-3768

1433-3015

This paper presents a three-dimensional kinematic simulation of surface topography ground by a D301 electroplated diamond wheel. For an individual cubo-octahedron diamond grain, its cutting process is modeled by decomposing it into active grain edges and discrete cutting points. By successively integrating the material removal caused by all the grains, the ground surface topography of workpiece is successfully predicted. The predicted surface roughness is close to the theoretical and experimental values with relative errors of − 7.9% and − 3.3% for aluminum and fused silica, respectively. The study reveals that the other amplitude parameters, e.g., kurtosis and skewness, of surface profiles can reflect the material removal mechanisms. The lateral pile-up of plastic aluminum alloy in grinding increases the kurtosis while the fracture of brittle fused silica results in a prominently negative skewness. For a fresh grinding wheel, the surface roughness Ra reaches a plateau after a rapid increase as the grinding depth increases to 1.25 times the SD of the grain protrusion heights. By contrast, the effects of grinding depth on the surface topography are negligible when the wear depth is beyond a certain value. As the feed rate increases, the number of active abrasive grains gradually increases. Meanwhile, the effect of the grain circumferential distribution on the workpiece surface topography becomes significant.

Electroplated diamond wheel Grinding Kinematic modeling Surface topography

SCI ; EI

英语

其他

China National Postdoctoral Program for Innovative Talents[BX20200268] ; National Natural Science Foundation of China[51720105016,51890884] ; Australian Research Council[DP190102959]

Automation & Control Systems ; Engineering

Automation & Control Systems ; Engineering, Manufacturing

WOS:000640176100001

SPRINGER LONDON LTD

20211710257017

Aluminum alloys ; Diamonds ; Fused silica ; Grinding (machining) ; Grinding wheels ; Higher order statistics ; Kinematics ; Piles ; Topography ; Wheels

Structural Members and Shapes:408.2 ; Gems:482.2.1 ; Aluminum Alloys:541.2 ; Machine Components:601.2 ; Machining Operations:604.2 ; Glass:812.3 ; Mathematical Statistics:922.2 ; Mechanics:931.1 ; Physical Properties of Gases, Liquids and Solids:931.2 ; Materials Science:951

ENGINEERING

2-s2.0-85104674148

Scopus

1.State Key Laboratory for Manufacturing Systems Engineering,School of Mechanical Engineering,Xi’an Jiaotong University,Xi’an,710049,China
2.Shenzhen Key Laboratory of Cross-scale Manufacturing Mechanics,Southern University of Science and Technology,Shenzhen,518055,China
3.Department of Mechanics and Aerospace Engineering,Southern University of Science and Technology,Shenzhen,518055,China
4.School of Mechanical and Manufacturing Engineering,The University of New South Wales,Sydney,2052,Australia

Li，Changsheng,Zhang，Liangchi,Ding，Jianjun,et al. Kinematic modeling of surface topography ground by an electroplated diamond wheel[J]. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2021,114:2753-2765.

Li，Changsheng.,Zhang，Liangchi.,Ding，Jianjun.,Wu，Chuhan.,Sun，Lin.,...&Jiang，Zhuangde.(2021).Kinematic modeling of surface topography ground by an electroplated diamond wheel.INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,114,2753-2765.

Li，Changsheng,et al."Kinematic modeling of surface topography ground by an electroplated diamond wheel".INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY 114(2021):2753-2765.